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DigiTimes
ASE, Wus to jointly build Kaohsiung advanced packaging plant by 2029
Advanced Semiconductor Engineering (ASE), the world's largest chip assembler, and PCB manufacturer Wus Printed Circuit are jointly building an advanced packaging plant in Kaohsiung, southern Taiwan, targeting completion by 2029. ASE has committed US$133 million to the project as part of broader capacity expansion fueled by surging AI-driven semiconductor demand. The facility will focus on advanced packaging technologies critical for high-performance AI chips. This move underscores Taiwan's central role in the global semiconductor supply chain and the intensifying race to secure advanced packaging capacity. The investment also reflects ASE's strategy to stay ahead of competitors and meet long-term demand from AI chip designers like Nvidia and AMD. The plant is expected to create jobs and bolster Taiwan's semiconductor ecosystem.
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Published 11 May 2026, 04:23 UTC1 min read
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Summary
TL;DR
- ASE and Wus Printed Circuit to jointly build advanced packaging plant in Kaohsiung by 2029.
- ASE commits US$133 million to expand advanced packaging capacity.
- Facility targets surging AI-driven semiconductor demand.
- Strengthens Taiwan's position in global semiconductor supply chain.
- Focuses on advanced packaging technologies for high-performance AI chips.
Interesting facts
- The plant is in Kaohsiung, a key semiconductor hub in southern Taiwan.
- Partnership with PCB maker Wus indicates vertical integration in packaging supply chain.
- US$133 million is a relatively small investment for ASE, suggesting phased expansion.