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DigiTimes
Samsung to break ground on KRW6 trillion Onyang HBM packaging plant in September
Samsung Electronics is preparing to break ground on a KRW6 trillion (approximately US$4.31 billion) high-bandwidth memory (HBM) production and advanced-packaging facility in September at its Onyang campus in Asan, South Korea. This project received approval after passing a provincial urban-planning review, reinforcing Samsung's commitment to expanding its semiconductor production capabilities. The new facility is expected to significantly increase Samsung's manufacturing capacity for HBM, which is crucial for data centers and high-performance computing applications.
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Published 20 Aug 2026, 04:20 UTC1 min read
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Summary
TL;DR
- Samsung to begin construction on a KRW6 trillion HBM facility in September.
- The plant will be located at the Onyang campus in Asan, South Korea.
- Project gained approval from provincial urban-planning authorities.
- Facility aims to boost production capacity for high-bandwidth memory.
- Investment indicates Samsung's strategic focus on semiconductor advancements.
Interesting facts
- The investment is part of Samsung's broader strategy to secure supply for high-demand memory markets.
- HBM is becoming increasingly important for applications in AI and data-intensive workloads.