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DigiTimes
Hanmi Semiconductor speeds up HBM tool output and plants US flag as equipment shortage looms
Hanmi Semiconductor has announced plans to boost its output of tooling equipment essential for manufacturing high-bandwidth memory (HBM). The company anticipates that demand will exceed supply from 2027, potentially leading to significant bottlenecks for the global memory and foundry sectors. This move aims to mitigate the expected shortages and establish strong footholds in the market amid rising demand for HBM, especially driven by advancements in AI technologies. As companies race to adopt more sophisticated memory solutions, the importance of maintaining equipment supply cannot be overstated.
MonitorConfidence: MediumShort term horizonSupply chain risk: High
Published 20 Jul 2026, 00:20 UTC1 min read
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Summary
TL;DR
- Hanmi Semiconductor is increasing production of HBM bonding equipment.
- Supply concerns arise as demand may outstrip availability by 2027.
- Global memory and foundry makers heavily rely on HBM tools.
- The move addresses potential bottlenecks in the semiconductor industry.
- Strategic efforts to establish a strong presence in the US market.
Interesting facts
- Demand for HBM is closely tied to the growth of AI applications.
- Shortages in semiconductor equipment could have far-reaching effects across the industry.
- Hanmi's push may strengthen US semiconductor infrastructure.