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EUV Machinery To Remain Paramount For China’s Commercial Chip Rise, Says Zeiss CEO, Doesn’t Believe Multi-Patterning Approach With Low Yields Is Viable Long-Term
Frank Rohmund, Zeiss CEO, stresses that China's semiconductor progress is heavily constrained by U.S. export controls preventing access to cutting-edge EUV technology. While multi-patterning techniques can yield 5nm-class chips, they suffer from low yield rates and increased costs, making them less viable in the long run. Without EUV, China's manufacturing will fall behind its global competitors, like TSMC.
MonitorConfidence: HighMid term horizonGeopolitical risk: High
Published 21 Jul 2026, 10:20 UTC2 min read
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Summary
TL;DR
- Zeiss CEO states multi-patterning techniques are inadequate for China's chip production.
- U.S. export controls block access to EUV machinery for China.
- China's semiconductor capabilities limited to 7nm node without EUV.
- Complexity and costs of multi-patterning lead to low yields.
- EUV technology considered vital for maintaining competitive edge.
Interesting facts
- Rohmund believes without government support, China's chip rise will remain limited.
- China's Kirin 9030 struggles against TSMC's EUV-made chips.
- Claims of China's in-house EUV machines trial production by 2025 lack updates.