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DigiTimes
Samsung weighs Besi's Korean rivals for 50-bonder hybrid bonding line as pricing talks drag on
Samsung Electronics is advancing its technology in the semiconductor space by preparing a die-to-wafer hybrid bonding production line at its Pyeongtaek campus, which will feature around 50 bonders. This facility aims to support the production of next-generation high-bandwidth memory and logic chips. As competition heats up in the sector, particularly with pricing negotiations involving Besi's Korean competitors, Samsung is positioning itself to maintain a technological edge in the evolving landscape of chip manufacturing.
MonitorConfidence: MediumMid term horizon
Published 23 Jul 2026, 08:20 UTC1 min read
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Summary
TL;DR
- Samsung plans to set up a hybrid bonding line in Pyeongtaek.
- The line will consist of approximately 50 bonders.
- Focus on next-generation high-bandwidth memory and logic chips.
- Pricing discussions are ongoing with Besi's Korean rivals.
- Emphasis on advanced semiconductor technology.
Interesting facts
- This move underscores Samsung's commitment to next-gen semiconductor innovation.
- Hybrid bonding technology could significantly enhance chip performance.
- Samsung's production line will strategically position it against rivals.