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DigiTimes
SoftBank, Intel target HBM limits with 9-layer memory
SoftBank's memory division, SAIMEMORY, is set to unveil a new 3D DRAM technology developed in partnership with Intel, catering to the growing AI hardware sector. This initiative seeks to mitigate power and heating limitations that high-bandwidth memory currently faces, highlighting an important shift as the industry strives for efficiency. This development comes at a time when demand for memory solutions has surged, particularly as companies pivot towards AI applications.
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Published 6 May 2026, 02:20 UTC1 min read
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Summary
TL;DR
- Collaboration between SoftBank's SAIMEMORY and Intel announced.
- New 3D DRAM technology aims to address heat and power issues.
- Focus on supporting the AI hardware industry's demands.
- Challenges faced by high-bandwidth memory technology highlighted.
- Increasing memory demand impacting global suppliers.
Interesting facts
- This collaboration signifies growing demand for reliable AI hardware.
- SoftBank’s shift towards AI-driven memory solutions reflects industry trends.
- The drive for innovative memory technologies is intensifying among competitors.