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DigiTimes
TSMC finally catching up to AI packaging demand after years of doubling capacity
TSMC has been effectively doubling its CoWoS (Chip on Wafer on Substrate) and SoIC (System on Integrated Chips) packaging capacity each year to cater to the increasing demand driven by the artificial intelligence sector. This expansion has led TSMC to achieve yields greater than 98%, with some products reaching up to 99% yield during high-volume manufacturing stages. As AI technology continues to proliferate, companies are relying on TSMC for advanced packaging solutions, further solidifying its position in the semiconductor industry.
MonitorConfidence: HighShort term horizon
Published 12 Aug 2026, 00:21 UTC1 min read
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Summary
TL;DR
- TSMC has doubled its CoWoS and SoIC packaging capacity annually.
- Current yield rates for CoWoS exceed 98%, sometimes reaching 99%.
- The improvements are primarily driven by the demand from AI customers.
- TSMC is in high-volume manufacturing for multiple AI products.
- The company continues to strengthen its position in the semiconductor market.
Interesting facts
- TSMC's capacity expansion reflects the accelerated rise of AI technologies.
- High manufacturing yields indicate strong quality control in TSMC's operations.