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DigiTimes
ASE expands globally as Hanmi Semiconductor targets CoWoS packaging demand
Hanmi Semiconductor is shifting from high-bandwidth memory (HBM) tools to advanced chip packaging to address increasing global demand linked with TSMC. ASE is also expanding its capacity to fulfill this demand, indicating a potential shift in the semiconductor supply chain landscape. As both companies ramp up production capabilities, this could affect supply constraints and pricing across various semiconductor products.
MonitorConfidence: MediumShort term horizon
Published 8 Jul 2026, 04:20 UTC1 min read
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Summary
TL;DR
- Hanmi Semiconductor diversifies into advanced chip packaging.
- Growth driven by rising demand from TSMC.
- ASE is increasing its production capacity.
- The semiconductor supply chain may be impacted.
- MediaTek and SK Hynix are responding to market pressures.
Interesting facts
- This moves Hanmi Semiconductor beyond its previous focus on HBM tools.
- The capacity expansion reflects a reaction to significant industry demand.
- Potential price increases are being reported by other major players like MediaTek.