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Apple’s A20 Pro With Newer Packaging On iPhone 18 Pro Logic Board Allegedly Leaked, Showing Bigger NPU But No Change To Package Size Compared To A19 Pro
Recent leaks concerning Apple's A20 Pro chip highlight significant advancements, particularly in packaging technology with the shift to Wafer-Level Multi-Chip Module (WMCM) design. This change is expected to enable better heat dissipation, enhancing performance during intensive tasks. Moreover, the increased size of the Neural Engine suggests a focus on bolstering on-device AI operations, positioning the iPhone 18 Pro as a more capable device for AI-driven applications. This transition reflects Apple's ongoing commitment to efficiency without escalating physical chip dimensions.
MonitorConfidence: MediumShort term horizon
Published 26 Jun 2026, 16:21 UTC3 min read
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Summary
TL;DR
- A20 Pro adopts WMCM packaging for improved heat management.
- Neural Engine size increased while maintaining overall package dimensions.
- Enhanced AI capabilities expected for Siri and on-device operations.
- Transition to LPDDR6 RAM suggested, although adoption may be slow.
- Efforts to manage chip costs while optimizing size noted.
Interesting facts
- The new packaging allows DRAM to be placed beside the chipset, improving heat dissipation.
- Apple's chip design expertise is credited for maintaining performance gains without size increases.