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Samsung Delays Hybrid Bonding HBM to 2029, Aligning Next-Gen Memory With NVIDIA's Feynman AI GPUs
Korean chipmaker Samsung has delayed the mass production of chips using hybrid bonding technology for high bandwidth memory (HBM) to 2029, in line with NVIDIA's upcoming Feynman AI GPUs. Hybrid bonding should enhance memory performance by reducing the space between DRAM layers. Samsung plans to procure hybrid bonding machines to initiate installations by year-end, aiming for a production ramp-up coinciding with NVIDIA’s product release timelines.
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Published 21 Jul 2026, 16:20 UTC2 min read
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Summary
TL;DR
- Hybrid bonding technology set for mass production in 2029
- Enhances performance by reducing space in DRAM layers
- Aligns with NVIDIA’s Feynman AI GPUs and Rubin Ultra chips
- Samsung acquiring 50 hybrid bonding machines
- Production ramp-up planned at Pyeongtaek facilities
Interesting facts
- Custom HBM chips may replace the base die with a customer-specific logic die.
- Samsung’s move could provide strategic advantages in future AI applications.
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