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Hybrid Bonding Was HBM4's Headline Upgrade, Yet Samsung and SK hynix May Sideline it Over Relaxed JEDEC rules
Hybrid bonding has become a key development for next-generation memory chips like HBM4, but recent reports suggest that Samsung and SK hynix may opt out due to relaxed standards set by JEDEC. Initially, HBM4 memory was expected to have a thickness of 900 micrometers, but adjustments now allow for a possible increase to 1,000 micrometers. The decision to skip hybrid bonding stems from both design considerations and the current market demands, with major customers like NVIDIA delaying orders. This strategic shift indicates that the companies may instead hold hybrid bonding for future iterations like HBM4E.
MonitorConfidence: MediumShort term horizon
Published 6 Jul 2026, 20:21 UTC3 min read
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Summary
TL;DR
- Hybrid bonding seen as crucial for next-gen HBM memory.
- JEDEC standards relaxation raises thickness limit to 1,000 micrometers.
- Samsung and SK hynix may delay hybrid bonding's introduction.
- Market pressure from customers like NVIDIA affects production decisions.
- Interest in heat dissipation methods without underfill remains.
Interesting facts
- Hybrid bonding improves heat dissipation by eliminating the underfill layer.
- JEDEC is actively considering further changes to thickness standards for future HBM generations.