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TrendForce
Market Trends and Outlook
The advanced packaging landscape is becoming increasingly important in the AI chip supply chain, with TSMC aggressively expanding its CoWoS (Chip-on-Wafer-on-Substrate) capacity and Intel enhancing its EMIB architecture. These advancements are crucial as the industry shifts toward 2.5D and 3D packaging methods, which facilitate tighter chiplet integration and higher performance. As semiconductor design moves toward smaller nodes, the need for advanced packaging technologies intensifies, emphasizing interconnect quality as a key factor in performance and efficiency.
MonitorConfidence: MediumMid term horizon
Published 19 Aug 2026, 04:30 UTC3 min read
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Summary
TL;DR
- TSMC expands CoWoS capacity significantly.
- Intel's EMIB sees yield improvements, enhancing competition.
- 2.5D and 3D packaging methods gaining traction.
- Chiplet design improves efficiency in semiconductor production.
- High interconnect quality essential for AI chip performance.
Interesting facts
- The industry's transition toward GAAFET technology is anticipated to further influence advanced packaging needs.
- TSMC's CoWoS technology achieves yields above 98%, showcasing its effectiveness in AI applications.
- Intel's EMIB technology offers cost advantages due to its design efficiency.