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DigiTimes
TSMC reportedly develops EMIB-like packaging to counter Intel
TSMC is reportedly venturing into advanced chip packaging by developing a technology modeled after Intel's Embedded Multi-die Interconnect Bridge (EMIB). This move signifies a strategic pivot toward enhancing their offerings in artificial intelligence (AI) semiconductor packaging, which is becoming increasingly important as competitors like Intel and Samsung also innovate in this space. With chip manufacturing already critical, this development could reshape market dynamics, particularly in AI applications.
MonitorConfidence: MediumShort term horizon
Published 31 Jul 2026, 04:20 UTC1 min read
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Summary
TL;DR
- TSMC is developing new chip packaging technology based on Intel's EMIB.
- The competition in AI semiconductor packaging is intensifying.
- Unimicron reports that Intel's EMIB-T will not reach mass production until 2027.
- US manufacturing push is attracting Taiwan suppliers with a significant increase in electronics investment.
- The rivalry between TSMC and Intel is expected to elevate further due to advancements in AI.
Interesting facts
- TSMC's initiative reflects a broader trend where packaging technologies are becoming essential complements to chip manufacturing.
- This development may influence which companies gain control over the AI chip market.