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DigiTimes
TSMC fast-tracks CoPoS—whole supply chain under gag order
TSMC is speeding up its CoWoS capacity expansion and advancing its new CoPoS technology, which features a round-to-square architecture. This move aims to alleviate cost and capacity limitations in large AI chip packaging. However, the entire supply chain operations are under a gag order, raising concerns about transparency in the sector. This development comes as companies face long lead times in chip production, particularly with TSMC's 3nm technology surpassing one-year delays.
MonitorConfidence: MediumMid term horizonSupply chain risk: High
Published 30 Jun 2026, 10:20 UTC1 min read
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Summary
TL;DR
- TSMC accelerates CoWoS capacity expansion.
- New CoPoS technology utilizes round-to-square architecture.
- Aims to alleviate cost challenges in AI chip packaging.
- Supply chain operations are under a gag order.
- 3nm lead times exceed one year.
Interesting facts
- CoPoS could revolutionize the way AI chips are packaged.
- TSMC's development might influence competition dynamics with rivals like Samsung.
Coverage gaps
- Details on the implications of the gag order on broader market dynamics